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Intel Modular Server

Technical Specifications

 

Chassis
Configuration

• 6U rack mount or pedestal based

Front

• Storage drive bay supports 14 hot-swap 2.5" SAS drives
• Up to 6 Server Compute Modules
• One Hot Swap I/O Fan Module

Rear

• One Management Module
• Up to two Ethernet Switch Modules
• Up to two Storage Control Modules
• Four power supply bays for 3+1 redundancy
• Two hot swap fan modules

Mid-Plane

• Connects subsystems to the Management Module
• Designed for multiple generations of Server Compute Modules
• Provides I/O for the system

Storage Control
Module

• RAID: 0, 1, 1E, 5, 6, 10
I/O:
External extended storage mini SAS port
Six internal 3GbPS SAS channels
• Active-Active redundancy
• Battery Backup

Ethernet Switch
Module

Ports
• Ten external 10/100/1000 GbE full-duplex ports
• Twelve internal 1-GB full-duplex ports
Management
• Port, VLAN, and Advanced Switch Configuration via the Management Module Layer 2+ features
• ACL, QOS, Link Aggregation, 10K Jumbo Frame support, VLAN support, STP, and RSTP
• Non-blocking I/O, wire-speed performance

Management
Module

I/O
• External 10/100 Ethernet port
• External serial port
Remote Management
• Remote Media
• Remote Console

   
To find out more about the Intel Modular Server Systems please contact our sales department at:

Tangent Inc.
191 Airport Boulevard
Burlingame, CA 94010

Phone 800.342.9388 x-2134
FAX 650.342.9380
Email 1sales1@tangent.com 
 

 

 

Server Computer Module

Processors
• Based on the Intel® 5000P series chipset and supports multi-core Intel® Xeon® processors Intel® 5000P chipset family, including:
• Intel® 5000P Memory Controller Hub
• Intel® 6321ESB I/O Controller Hub

Memory
• 8 fully-buffered DIMM (FBDIMM) slots supporting up to 32GB of memory On-board host bus adapter
• LSI* 1064e SAS controller

LAN
• Two integrated 10/100/1000 Ethernet ports and two optional 10/100/1000 Ethernet ports via the Mezzanine Card On-board Video
• Server Compute Module ATI* ES1000 video controller with 16 MB of DDR SDRAM External Connectors
• Two USB 2.0 ports
• Video connector

Internal Connectors
• One Intel® I/O Mezzanine Connector supporting an optional Mezzanine Card

Mezzanine Card

• Provides additional dual-channel Ethernet ports
• Intel® Modular Server Accessory AXXGBIOMEZ

Chassis Size

• Height: 10.3 inches (6U)
• Width: 17.5 inches
• Depth: 28.4 inches
• Weight with full configuration: 187 lbs.

Chassis Power
Requirement

• Up to four 1,000-watt DC output power supply modules with 110-240V AC input
• Full system configuration power requirements: 3,000 watts

Chassis Acoustical
Noise Emissions

• Sound power 70 dB maximum

Chassis
Environment

• Temperature operating: 10°C to 35°C 50°F to 95°F
• Temperature non-operating: -40°C to 70°C -40°F to 158°F
• Altitude: -30 to 1,500 m -100 to 5,000 ft

Chassis Safety

• UL60 950, CSA60 950, AS/NZS 3562, GB4943-1995, EN60 950 and 73/23/EEC, IEC 60 950, EMKO-TSE (74SEC) 207/94, GOST-R 50377-92

Chassis
Emissions

• Certified to FCC Class A; tested to CISPR 22 Class A, EN 55022 Class A and 89/336/EEC, VCCI Class A, AS/NZS 3548 Class A, ICES-003 Class A, GB9254-1998, MIC Notice 1997-42 Class A, GOST-R 29216-91 Class A, BSMI CNS13438


 

 

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